EBSD: Electron Backscatter Diffraction
Reveal crystal orientations, grain boundaries, and phase distributions with nanometer-scale spatial resolution.
Electron Backscatter Diffraction (EBSD) is a powerful SEM-based technique that determines the crystallographic orientation of materials at each point in a scan. By analyzing diffraction patterns formed when electrons scatter from crystal lattice planes, EBSD creates detailed maps of grain structure, texture, and phase distribution.
How EBSD Works
When a focused electron beam strikes a crystalline sample tilted to approximately 70°, electrons are diffracted by atomic planes according to Bragg’s law. These diffracted electrons form a pattern of intersecting bands called Kikuchi patterns (or electron backscatter patterns, EBSPs) on a phosphor screen.
A sensitive camera captures these patterns, and software indexes them by comparing band positions and angles to known crystal structures. This process determines the precise 3D orientation of the crystal at each measurement point, typically achieving angular resolution better than 0.5°.
Key Capabilities
Orientation Mapping
Create color-coded maps showing crystal orientation at every pixel. Inverse Pole Figure (IPF) maps reveal texture and preferred orientations in polycrystalline materials.
Grain Analysis
Automatically detect and measure grain size, shape, and distribution. Analyze grain boundary character, twin boundaries, and coincident site lattice (CSL) relationships.
Phase Identification
Distinguish crystallographically distinct phases even when chemically similar. Combined with EDS, identify phases by both structure and composition.
Strain Analysis
Detect residual strain and plastic deformation through pattern quality maps and local misorientation analysis (KAM, GOS, GAM metrics).
Applications
Materials Science
- Metallurgy: Study recrystallization, grain growth, and deformation mechanisms in metals and alloys
- Failure Analysis: Investigate fracture paths relative to grain boundaries and crystallographic planes
- Welding: Characterize heat-affected zones and solidification microstructures
Geology & Mineralogy
- Petrology: Determine deformation history and metamorphic conditions from mineral orientations
- Ore Analysis: Identify mineral phases and textural relationships
Semiconductor & Electronics
- Thin Films: Analyze texture and grain structure in deposited layers
- Solar Cells: Study grain boundaries that affect carrier recombination
Additive Manufacturing
- 3D Printed Metals: Characterize columnar grain growth and texture development
- Process Optimization: Correlate microstructure with build parameters
Sample Requirements
EBSD requires a flat, strain-free surface with minimal contamination. Proper sample preparation is critical:
- Mechanical Polishing: Progressive grinding and polishing to remove deformation layers
- Final Polish: Colloidal silica (OPS) or electropolishing for optimal pattern quality
- Conductivity: Conductive samples work best; non-conductive samples may need carbon coating
- Tilt: Sample must be tilted 70° toward the detector for optimal diffraction geometry
EBSD + EDS Integration
Combining EBSD with Energy Dispersive Spectroscopy (EDS) provides comprehensive material characterization. While EBSD determines crystal structure and orientation, EDS reveals elemental composition. Together, they enable:
- Unambiguous phase identification when phases have similar structures or compositions
- Correlation of chemistry with grain boundaries and precipitates
- Complete microstructural analysis in a single acquisition
Recommended Equipment
Related Technology
Resources
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